Mfr Part Number: AS5-12G#Features: # Contains 99.9% pure silver#High-Density(contains over 88% thermally conductive filler by weight)#Controlled Tripple-Phase Viscosity#Not Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed)# # Thermal Conductance: 300,000W
Detailed Features
l> #Contains 99.9% pure silver #High-Density(contains over 88% thermally conductive filler by weight) #Controlled Tripple-Phase Viscosity #Not Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed) #Thermal Conductance: >300,000W/m2 °C (0.001 inch layer) #Thermal Resistance: <0.0045°C-in2/Watt (0.001 inch layer) #Average Particle Size: <0.49 microns <0.000020 inch #Extended Temperature Limits: Peak: -50°C to >180°C Long-Term: -50°C to 130°C #Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core
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