Mfr Part Number: AS5-3.5G Features: Contains 99.9% pure silver, High-Density(contains over 88% thermally conductive filler by weight), Controlled Tripple-Phase Viscosity, Not Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed) Thermal Conductance: 300,000W/m2
Detailed Features
s 99.9% pure silver, High-Density(contains over 88% thermally conductive filler by weight), Controlled Tripple-Phase Viscosity, Not Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed) #Thermal Conductance: >300,000W/m2 C (0.001 inch layer) #Thermal Resistance: <0.005C-in2/Watt (0.001 inch layer) #Average Particle Size: <0.49 microns <0.000020 inch #Extended Temperature Limits: Peak: 50C to >180C Long-Term: 50C to 130C #Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. #Coverage Area: The 3.5 gram tube contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram tube will cover approximately 16 square inches.
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